With its capacity, technology, and expert team, Özdisan offers its customers the highest quality electronic card assembly service in the facilities belonging to its group companies. In these facilities, many processes, including soldering in a nitrogen environment, 3D automated optical inspection (3D AOI), 3D solder paste inspection (3D SPI), conformal coating, automatic local soldering, and PCB-A washing are carried out at IPC 610 Class 3 level with the help of X-ray devices, environmental test cabins, BGA repair stations, and humidity cabins.